公开(公告)号：US20240234268A9

公开(公告)日：2024-07-11

申请号：US18204161

申请日：2023-05-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SEUNGWAN SHIN ,  JUNGHOON KANG ,  BYUNGMIN YU ,  JUNG HYUN LEE

IPC: H01L23/498 ,  H01L23/31

CPC classification number: H01L23/49811 ,  H01L23/3128 ,  H01L23/49838

Abstract: A semiconductor package includes: a first redistribution substrate; a semiconductor chip provided on the first redistribution substrate; a molding material molding the semiconductor chip and the first redistribution substrate; and a second redistribution substrate provided on the molding material, wherein the second redistribution substrate includes: at least one redistribution line; a metal pad; and a dielectric layer molding the at least one redistribution line and the metal pad, wherein the dielectric layer includes a marking region on the metal pad, and the metal pad includes a plurality of concave portions.

公开(公告)号：US20240136261A1

公开(公告)日：2024-04-25

申请号：US18204161

申请日：2023-05-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SEUNGWAN SHIN ,  JUNGHOON KANG ,  BYUNGMIN YU ,  JUNG HYUN LEE

IPC: H01L23/498 ,  H01L23/31

CPC classification number: H01L23/49811 ,  H01L23/3128 ,  H01L23/49838

Abstract: A semiconductor package includes: a first redistribution substrate; a semiconductor chip provided on the first redistribution substrate; a molding material molding the semiconductor chip and the first redistribution substrate; and a second redistribution substrate provided on the molding material, wherein the second redistribution substrate includes: at least one redistribution line; a metal pad; and a dielectric layer molding the at least one redistribution line and the metal pad, wherein the dielectric layer includes a marking region on the metal pad, and the metal pad includes a plurality of concave portions.