公开(公告)号：US20190165975A1

公开(公告)日：2019-05-30

申请号：US16191611

申请日：2018-11-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Barosaim SUNG ,  Chilun LO ,  Jae-hoon LEE ,  Jong-woo LEE ,  Seung-hyun OH

IPC: H04L27/227 ,  H04L27/38 ,  H03G3/30 ,  H04B1/403

Abstract: A radio frequency (RF) integrated circuit is provided. The RF integrated circuit supports carrier aggregation and includes first receiving circuits and a first shared phase locked loop circuit that provides a first frequency signal of a first frequency to the first receiving circuits. One of the first receiving circuits includes an analog to digital converter (ADC) and a digital conversion circuit. The ADC converts an RF signal received by the one of the first receiving circuits to a digital signal by using the first frequency signal. The digital conversion circuit generates a digital baseband signal by performing frequency down conversion on the digital signal.