公开(公告)号：US11671287B2

公开(公告)日：2023-06-06

申请号：US17511186

申请日：2021-10-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngsan Kang ,  Byungyo Lee

IPC: H04L25/03 ,  H04L25/06 ,  H04L25/02

CPC classification number: H04L25/03878 ,  H04L25/028 ,  H04L25/0292 ,  H04L25/03254 ,  H04L25/062

Abstract: An interconnect module device is provided. The interconnect module device includes a line control command (LCC) detecting circuit configured to identify an LCC signal; an equalizer control circuit configured to generate a control signal based on the LCC signal; a receiving equalizer configured to perform receiving equalization on a first signal received from a first universal flash storage (UFS) device based on the control signal to generate a second signal; and a transmitting equalizer configured to perform transmitting equalization on the second signal to generate a third signal based on the control signal, and transmit the third signal to a second UFS device.