公开(公告)号：US20210345489A1

公开(公告)日：2021-11-04

申请号：US17225209

申请日：2021-04-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： CHUNGHYUN RYU ,  BYUNGOK KANG ,  SU-YONG AN ,  JONGWOO JANG ,  INSUB KWAK ,  TECK SU OH ,  GEURIM JUNG ,  SANG-HO PARK ,  SUNG-KI LEE

IPC: H05K1/18 ,  H01G9/08

Abstract: A capacitor module configured to be horizontally mounted on a PCB and including; a case including a first side surface, an opposing second side, a first electrode pad and a second electrode pad disposed at the first side surface, and a third electrode pad disposed at the second side surface, and an electrolytic capacitor including a dielectric extending in a first horizontal direction, a first electrode contacting the first electrode pad and a second electrode contacting the second electrode pad, wherein the first electrode pad is spaced apart from second electrode pad in a second horizontal direction.