公开(公告)号：US10559540B2

公开(公告)日：2020-02-11

申请号：US16004007

申请日：2018-06-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chang Bo Lee ,  Joon Seok Oh ,  Hyun Chul Jung ,  Jeong Ho Yeo

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/00

Abstract: A fan-out semiconductor package includes a first connection member having a through-hole first and second semiconductor chips disposed in the through-hole, an encapsulant encapsulating the first and second semiconductor chips, a second connection member disposed on at least one side of the first and second semiconductor chips and including a redistribution layer electrically connected to the first and second semiconductor chips, and an insulating via in which at least a portion of the first connection member is removed in a thickness direction and is filled with an insulating material.