公开(公告)号：US10365021B2

公开(公告)日：2019-07-30

申请号：US14598377

申请日：2015-01-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Soo Dol Park ,  Jeong Bae Lee ,  Min-Soo Yang ,  Chi Dae Yang

IPC: F25B31/02 ,  F25B1/04

Abstract: A cooling apparatus includes a compressor; a condenser for condensing a refrigerant discharged from the compressor, an expansion valve to expand the refrigerant discharged from the condenser, and an evaporator to evaporate the refrigerant discharged from the expansion valve and to deliver the refrigerant to the compressor. The compressor includes a rotary compressor having a displacement volume less than about 3 cc, and refrigerant circulating inside the cooling apparatus includes at least one of R290, R600a, R123a, R1234yf, and R1234ze. The cooling apparatus and compressor attain miniaturization and high efficiency.