公开(公告)号：US20250167135A1

公开(公告)日：2025-05-22

申请号：US18749785

申请日：2024-06-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jongkook Kim ,  Heungkyu Kwon ,  Junghwan Jang ,  Youngcheol Kim ,  Choonheung Lee ,  Minki Ahn ,  Jaegwon Jang ,  Hangchul Choi ,  Heejung Choi

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/36 ,  H01L23/49 ,  H01L23/498 ,  H01L23/538 ,  H01L25/16

Abstract: A semiconductor package including a first redistribution structure, a second redistribution structure disposed on the first redistribution structure, a semiconductor chip disposed on an upper surface of the second redistribution structure, a bridge chip disposed on a lower surface of the second redistribution structure, a molding layer disposed between the first redistribution structure and the second redistribution structure, where the molding layer surrounds the bridge chip, and a stiffener disposed on the upper surface of the second redistribution structure. The stiffener includes an opening. The semiconductor chip is disposed in the opening of the stiffener.