公开(公告)号：US20220189860A1

公开(公告)日：2022-06-16

申请号：US17687072

申请日：2022-03-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seongchan PARK ,  Sanghyun KWON ,  Hyungkyu KIM ,  Han KIM ,  Choonkeun LEE ,  Seungon KANG

IPC: H01L23/495 ,  H01L23/433 ,  H01L23/31 ,  H01L23/498 ,  H01L23/373 ,  H01L23/367

Abstract: A semiconductor package includes: a semiconductor chip having an active surface, on which a connection pad is disposed, and an inactive surface opposite to the active surface; a heat-dissipating member disposed on the inactive surface of the semiconductor chip and including graphite; an encapsulant sealing at least a portion of each of the semiconductor chip and the heat-dissipating member; a capping metal layer disposed directly between the heat-dissipating member and the encapsulant; and a connection structure disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad, wherein the heat-dissipating member includes holes passing through at least a portion of the heat-dissipating member, and the holes overlap the inactive surface of the semiconductor chip.