公开(公告)号：US20210296153A1

公开(公告)日：2021-09-23

申请号：US17189392

申请日：2021-03-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kihong CHO ,  Kyuchul SHIM ,  Chungho CHO ,  Jiho UH ,  Jinseok LEE ,  Namki CHO

IPC: H01L21/683 ,  H01J37/32

Abstract: A substrate processing apparatus including an electrostatic chuck on which a substrate is mountable; a ring surrounding the electrostatic chuck, the ring including a first coupling groove; and a first floating electrode in the first coupling groove of the ring, the first floating electrode having a ring shape, wherein a top surface of the first floating electrode is exposed at the ring, and the first floating electrode has a tapered shape including an inclined surface that is inclined in a downward direction toward the electrostatic chuck.