公开(公告)号：US20220174842A1

公开(公告)日：2022-06-02

申请号：US17665518

申请日：2022-02-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SUNG CHUL HUR ,  DO IL KONG

IPC: H05K7/20 ,  H05K5/00 ,  H05K1/18 ,  H05K1/02

Abstract: A solid-state drive device includes a first module including a first region containing a volatile main memory device and a controller device and a second region containing a first nonvolatile memory device, a second module disposed on the first module and having a third region containing a second nonvolatile memory device, the second module being connected to the first module, and a heat dissipating member disposed on the second module as vertically juxtaposed with the first and second modules. The heat dissipating member has a protruding portion protruding toward the first module and in direct thermal contact with the first region, and a plate-shaped portion having a main surface in direct thermal contact with the third region.

公开(公告)号：US20200154606A1

公开(公告)日：2020-05-14

申请号：US16740593

申请日：2020-01-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SUNG CHUL HUR ,  DO IL KONG

IPC: H05K7/20 ,  H05K5/00 ,  H05K1/02 ,  H05K1/18

Abstract: A solid-state drive device includes a first module including a first region containing a volatile main memory device and a controller device and a second region containing a first nonvolatile memory device, a second module disposed on the first module and having a third region containing a second nonvolatile memory device, the second module being connected to the first module, and a heat dissipating member disposed on the second module as vertically juxtaposed with the first and second modules. The heat dissipating member has a protruding portion protruding toward the first module and in direct thermal contact with the first region, and a plate-shaped portion having a main surface in direct thermal contact with the third region.