公开(公告)号：US12108613B2

公开(公告)日：2024-10-01

申请号：US17510576

申请日：2021-10-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Keewon Kim ,  Byeongtaek Bae ,  Dail Eom ,  Minkyung Lee ,  Hajin Lim

IPC: H10K39/32 ,  H10K30/87

CPC classification number: H10K39/32 ,  H10K30/87

Abstract: A photoelectric conversion device includes a substrate and a wiring layer disposed on the substrate. The wiring layer includes a wiring structure and a wiring insulating layer that surrounds the wiring structure. A reflective layer is disposed on the wiring layer. The reflective layer is electrically connected to the wiring structure. A semi-permeable metal layer is spaced apart from the reflective layer in a thickness direction of the substrate. The semi-permeable metal layer faces the reflective layer to form a microcavity between the reflective layer and the semi-permeable metal layer. A stacked structure is between the reflective layer and the semi-permeable metal layer in the thickness direction of the substrate. The stacked structure includes a photoelectric conversion layer, a transparent electrode layer, and an insulating optical spacer.

公开(公告)号：US20220238604A1

公开(公告)日：2022-07-28

申请号：US17510576

申请日：2021-10-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Keewon Kim ,  Byeongtaek Bae ,  Dail Eom ,  Minkyung Lee ,  Hajin Lim

IPC: H01L27/30 ,  H01L51/44

Abstract: A photoelectric conversion device includes a substrate and a wiring layer disposed on the substrate. The wiring layer includes a wiring structure and a wiring insulating layer that surrounds the wiring structure. A reflective layer is disposed on the wiring layer. The reflective layer is electrically connected to the wiring structure. A semi-permeable metal layer is spaced apart from the reflective layer in a thickness direction of the substrate. The semi-permeable metal layer faces the reflective layer to form a microcavity between the reflective layer and the semi-permeable metal layer. A stacked structure is between the reflective layer and the semi-permeable metal layer in the thickness direction of the substrate. The stacked structure includes a photoelectric conversion layer, a transparent electrode layer, and an insulating optical spacer.