IMAGE SENSOR
    1.
    发明公开
    IMAGE SENSOR 审中-公开

    公开(公告)号:US20230395635A1

    公开(公告)日:2023-12-07

    申请号:US18204783

    申请日:2023-06-01

    Abstract: An image sensor includes a first substrate including a first surface and a second surface opposite to the first surface, a first wiring structure provided on the second surface of the first substrate, the first wiring structure including a first wiring and a first inter-wiring insulating film, a second substrate including a third surface facing the second surface of the first substrate, and a fourth surface opposite to the third surface, a second wiring structure provided on the third surface of the second substrate, the second wiring structure including a second wiring and a second inter-wiring insulating film, a via trench penetrating the first substrate and the first wiring structure, a through via structure extending along the via trench and connected to the second wiring, and a pad pattern provided on the through via.

    Image Sensor
    2.
    发明申请
    Image Sensor 审中-公开

    公开(公告)号:US20190115375A1

    公开(公告)日:2019-04-18

    申请号:US15933514

    申请日:2018-03-23

    Abstract: An image sensor includes a substrate including opposite first and second surfaces, first and second gates, on the first surface of the substrate, which each extend in a first direction, a first isolation layer in the substrate between the first and second gates and having a first width in a second direction crossing the first direction, a second isolation layer on the first isolation layer, in the substrate, and having a second width smaller than the first width in the second direction. The second isolation layer is closer to the second surface of the substrate than the first isolation layer. A vertical distance between the first isolation layer and the second isolation layer is ⅓ or less of a height of the first isolation layer.

Patent Agency Ranking