公开(公告)号：US20230384239A1

公开(公告)日：2023-11-30

申请号：US18446837

申请日：2023-08-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doyoung YOON ,  Jeongho AHN ,  Dongryul LEE ,  Dongchul IHM ,  Chungsam JUN

IPC: G01N21/95 ,  H01L21/66 ,  G01N21/88 ,  G01N21/956

CPC classification number: G01N21/9501 ,  H01L22/12 ,  G01N21/8806 ,  G01N21/956

Abstract: A semiconductor wafer inspection system includes a wafer chuck disposed inside a chamber and on which a wafer is disposed, a light source configured to emit light for inspecting a pattern on the wafer to the wafer, an inspection controller configured to control the driving of the light source, a cooling gas gun disposed adjacent to the light source and configured to spray a cooling gas on a surface of the wafer, and a cooling controller configured to supply cooling air to the wafer chuck before light is emitted to the wafer and supply the cooling gas to the cooling gas gun.

公开(公告)号：US20230123710A1

公开(公告)日：2023-04-20

申请号：US17501318

申请日：2021-10-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doyoung YOON ,  Jeongho AHN ,  Dongryul LEE ,  Dongchul IHM ,  Chungsam JUN

IPC: G01N21/95 ,  G01N21/956 ,  G01N21/88 ,  H01L21/66

Abstract: A semiconductor wafer inspection system includes a wafer chuck disposed inside a chamber and on which a wafer is disposed, a light source configured to emit light for inspecting a pattern on the wafer to the wafer, an inspection controller configured to control the driving of the light source, a cooling gas gun disposed adjacent to the light source and configured to spray a cooling gas on a surface of the wafer, and a cooling controller configured to supply cooling air to the wafer chuck before light is emitted to the wafer and supply the cooling gas to the cooling gas gun.