公开(公告)号：US20150221702A1

公开(公告)日：2015-08-06

申请号：US14596464

申请日：2015-01-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JUNG-KYU JUNG ,  SANG-CHUL SUL ,  GWI-DEOK LEE ,  TAE-YON LEE ,  MYUNG-WON LEE

IPC: H01L27/30 ,  H01L27/28

CPC classification number: H01L27/307 ,  H01L27/14603 ,  H01L27/14609 ,  H01L27/1463 ,  H01L27/1464 ,  H01L27/14643 ,  H01L27/14665 ,  H01L27/286

Abstract: Provided are an image sensor and an image processing device. The image sensor includes a semiconductor layer, an organic photoelectric conversion portion disposed on an upper surface of the semiconductor layer and converts a color component of incident light into a corresponding electrical signal, a transistor layer disposed on a lower surface of the semiconductor layer and including a pixel circuit that receives the electrical signal, and penetration wiring that laterally penetrates a side surface of the semiconductor layer between the upper and lower surfaces and that electrically connects the organic photoelectric conversion portion with the pixel circuit to communicate the electrical signal.

Abstract translation: 提供了图像传感器和图像处理装置。 图像传感器包括半导体层，设置在半导体层的上表面上的有机光电转换部分，并将入射光的颜色分量转换为对应的电信号，设置在半导体层的下表面上的晶体管层， 接收电信号的像素电路和横向穿透上下表面之间的半导体层的侧表面的穿透布线，并且将有机光电转换部分与像素电路电连接以传送电信号。