公开(公告)号：US11662659B2

公开(公告)日：2023-05-30

申请号：US17306644

申请日：2021-05-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Donghwan Kim ,  Woosung Kim ,  Gunwoo Park ,  Ki-Bong Seo ,  Jang-Hwan Jeong

IPC: G03F1/38 ,  H01L21/027 ,  H01L21/768 ,  G03F7/20

CPC classification number: G03F1/38 ,  G03F7/70283 ,  H01L21/0274 ,  H01L21/76805 ,  H01L21/76816 ,  H01L21/76877 ,  H01L21/76895

Abstract: Disclosed are a photomask, an exposure apparatus, and a method of fabricating a three-dimensional semiconductor memory device using the same. The photomask may include a mask substrate, a first mask pattern on the mask substrate, and an optical path modulation substrate. The optical path modulation substrate may include a first region on a portion of the first mask pattern, and a second region on another portion of the first mask pattern. The second region has a thickness that is less than a thickness of the first region.