公开(公告)号：US20250062266A1

公开(公告)日：2025-02-20

申请号：US18653664

申请日：2024-05-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gyunghwan Oh ,  Sangmin Lee

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L25/10

Abstract: A semiconductor package includes a redistribution substrate including a first surface and a second surface which are opposite to each other, a semiconductor chip on the first surface of the redistribution substrate, and a connection terminal on the second surface of the redistribution substrate. The redistribution substrate includes an insulating layer, a redistribution pattern in the insulating layer, and an under bump pattern between the redistribution pattern and the connection terminal. The under bump pattern includes a via portion penetrating the insulating layer and connected to the redistribution pattern, and a protrusion protruding into the insulating layer.