公开(公告)号：US20230411238A1

公开(公告)日：2023-12-21

申请号：US18089615

申请日：2022-12-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： ILHAN YUN ,  SUNG-KI LEE ,  HYEKYOUNG LEE

IPC: H01L23/373 ,  H05K7/20

CPC classification number: H01L23/3735 ,  H05K7/20436 ,  H05K7/20509 ,  H10B80/00

Abstract: A solid state drive (SSD) includes a case including a planar portion, a protrusion portion protruding from the planar portion, and a plurality of fins protruding from the planar portion and defining an internal space, a printed circuit board located within the internal space of the case and including a semiconductor device and a controller, and a heat dissipation sheet covering the planar portion and the protrusion portion of the case. The plurality of fins are spaced apart from the protrusion portion and the printed circuit board in a first direction, an upper surface of the semiconductor device and an upper surface of the controller are in direct contact with the heat dissipation sheet, and the heat dissipation sheet includes at least one of graphite, graphene, carbon nanotubes, and fullerene.