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公开(公告)号:US20230114817A1
公开(公告)日:2023-04-13
申请号:US17857291
申请日:2022-07-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Inho SHIN , Wookrae KIM , Changhyeong YOON , Myungjun LEE , Heonju SHIN , Sangil IM , Sungho JANG
Abstract: A semiconductor measurement apparatus includes an illumination unit including a light source, and a polarizer disposed on a propagation path of light emitted from the light source; an optical unit configured to direct the light passing through the polarizer to be incident onto a sample, and to transmit the light, reflected from the sample, to an image sensor; and a controller configured to process an original image, output by the image sensor, to determine a critical dimension of a structure included in a region of the sample on which the light is incident. The controller acquires a two-dimensional image. The controller orthogonally decomposes the two-dimensional image corresponding to a selected wavelength into a plurality of bases, generates one-dimensional data including a plurality of weights corresponding to the plurality of bases, and uses the one-dimensional data to determine a selected critical dimension among critical dimensions of the structure.