公开(公告)号：US20240226941A1

公开(公告)日：2024-07-11

申请号：US18502055

申请日：2023-11-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jun Hee LEE ,  Kyoung Whan OH ,  Ho Kyun KIM

IPC: B05B12/00 ,  B05B1/08

CPC classification number: B05B12/006 ,  B05B1/08

Abstract: An apparatus for supplying a treating material includes a nozzle discharging the treating material onto a substrate. A flow pipe channels the treating material to the nozzle. A cut-off valve connected to the flow pipe controls the discharge the treating material. A first controller controls a first opening and closing of the cut-off valve. A second controller controls a second opening and closing of the cut-off valve. The second opening and closing of the cut-off valve is performed by the second controller after a delay time has elapsed after the first opening and closing is completed.