公开(公告)号：US20200311552A1

公开(公告)日：2020-10-01

申请号：US16829205

申请日：2020-03-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yong A ,  Gaofei Wang ,  Zhenbo Luo ,  Shuli Yang ,  Bin Sun ,  Pei Fu ,  Hua Wang

IPC: G06N3/08 ,  G06N3/04

Abstract: A method for compressing a machine learning model by an electronic device. The method may comprise determining a compression parameter of a set hidden layer in a model based on a pruning number of respective channels included in the set hidden layer and a pruning loss of each hidden layer of the model; and compressing the model based on the compression parameter of the set hidden layer. The compression parameter may be related to a pruning of the model.