公开(公告)号：US10455687B2

公开(公告)日：2019-10-22

申请号：US15230596

申请日：2016-08-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dae-woong Cho ,  Dong-keun Kim ,  Sung-woo Kim ,  Hyeong-gwon Kim ,  Ji-hoon Park

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H01F27/28 ,  H01F27/29 ,  H01F17/02 ,  H01F27/32

Abstract: A circuit board for a power supply, an electronic apparatus including the same, and an inductor device are provided. The circuit board includes a first pattern arranged on a first layer of the circuit board and including a first terminal coupled to a coil, a first layer region arranged on the first layer, the coil being disposed on the first layer region, and a second pattern arranged on a second layer of the circuit board, below the first layer. The second pattern includes a first blank region located below the first layer region, and has no conductive material arranged thereon.