公开(公告)号：US20230416555A1

公开(公告)日：2023-12-28

申请号：US18186513

申请日：2023-03-20

Applicant: Samsung Electronics Co., Ltd. ,  NOROO Paint & Coatings Co., Ltd.

Inventor： Hyunjung JUNG ,  Hangyu HWANG ,  Kisun LEE ,  Wonki LEE ,  Sungjun JANG ,  Byounggi CHO ,  Hyeonseok YOON ,  Hyoin KIM

IPC: C09D133/14 ,  C09D175/04

CPC classification number: C09D133/14 ,  C09D175/04

Abstract: A housing of an electronic device including polymer materials is provided. The housing includes a polymer substrate, a primer layer disposed on at least a portion of the polymer substrate, a color layer disposed on the primer layer, and a coating layer disposed on the color layer. The primer layer, the color layer, and the coating layer include a biomass polyurethane resin and have a glass transition temperature of 80° C. to 110° C.

公开(公告)号：US20230120057A1

公开(公告)日：2023-04-20

申请号：US17972321

申请日：2022-10-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunjung JUNG ,  Hangyu HWANG ,  Hyeonseok YOON ,  Hyoin KIM

IPC: G06F3/0354 ,  H05K5/02

Abstract: An electronic device housing includes an instrument, a first primer layer provided to cover the instrument, a film layer provided on the first primer layer, a second primer layer provided on the film layer, and a coating layer provided on the second primer layer. The film layer includes at least one overwrap at which the film layer overlaps that is configured to surround the first primer layer.