公开(公告)号：US11354798B2

公开(公告)日：2022-06-07

申请号：US16886591

申请日：2020-05-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kang Won Lee ,  Cheol Ki Min ,  Jong Ju Park ,  Hyon Seok Song

IPC: G06T7/00 ,  G06T7/33 ,  G06V10/56 ,  G06V10/75

Abstract: A defect inspecting apparatus includes a reference image generator configured to generate a first reference image and a second reference image from design layout data. An image inspector is configured to obtain a first inspection image of a first inspection region of a photomask and a second inspection image of a second inspection region of the photomask. An operation processor is configured to extract a first coordinate offset by comparing the first inspection image with the first reference image and to extract a second coordinate offset by comparing the second inspection image with the second reference image.

公开(公告)号：US20200294219A1

公开(公告)日：2020-09-17

申请号：US16886591

申请日：2020-05-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： KANG WON LEE ,  Cheol ki Min ,  Jong Ju Park ,  Hyon Seok Song

IPC: G06T7/00 ,  G06K9/62 ,  G06K9/46 ,  G06T7/33

Abstract: A defect inspecting apparatus includes a reference image generator configured to generate a first reference image and a second reference image from design layout data. An image inspector is configured to obtain a first inspection image of a first inspection region of a photomask and a second inspection image of a second inspection region of the photomask. An operation processor is configured to extract a first coordinate offset by comparing the first inspection image with the first reference image and to extract a second coordinate offset by comparing the second inspection image with the second reference image.

公开(公告)号：US10726541B2

公开(公告)日：2020-07-28

申请号：US16013417

申请日：2018-06-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kang Won Lee ,  Cheol Ki Min ,  Jong Ju Park ,  Hyon Seok Song

IPC: G06T7/00 ,  G06K9/62 ,  G06K9/46 ,  G06T7/33

Abstract: A defect inspecting apparatus includes a reference image generator configured to generate a first reference image and a second reference image from design layout data. An image inspector is configured to obtain a first inspection image of a first inspection region of a photomask and a second inspection image of a second inspection region of the photomask. An operation processor is configured to extract a first coordinate offset by comparing the first inspection image with the first reference image and to extract a second coordinate offset by comparing the second inspection image with the second reference image.

公开(公告)号：US11727557B2

公开(公告)日：2023-08-15

申请号：US17661830

申请日：2022-05-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kang Won Lee ,  Cheol Ki Min ,  Jong Ju Park ,  Hyon Seok Song

IPC: G06T7/00 ,  G06T7/33

CPC classification number: G06T7/001 ,  G06T7/337 ,  G06T7/97 ,  G06T2207/30148

Abstract: A defect inspecting apparatus includes a reference image generator configured to generate a first reference image and a second reference image from design layout data. An image inspector is configured to obtain a first inspection image of a first inspection region of a photomask and a second inspection image of a second inspection region of the photomask. An operation processor is configured to extract a first coordinate offset by comparing the first inspection image with the first reference image and to extract a second coordinate offset by comparing the second inspection image with the second reference image.

公开(公告)号：US20190139209A1

公开(公告)日：2019-05-09

申请号：US16013417

申请日：2018-06-20

Applicant: SAMSUNG ELECTRONICS CO., LTD

Inventor： Kang Won Lee ,  Cheol Ki Min ,  Jong Ju Park ,  Hyon Seok Song

IPC: G06T7/00 ,  G06K9/62 ,  G06T7/33 ,  G06K9/46

Abstract: A defect inspecting apparatus includes a reference image generator configured to generate a first reference image and a second reference image from design layout data. An image inspector is configured to obtain a first inspection image of a first inspection region of a photomask and a second inspection image of a second inspection region of the photomask. An operation processor is configured to extract a first coordinate offset by comparing the first inspection image with the first reference image and to extract a second coordinate offset by comparing the second inspection image with the second reference image.