公开(公告)号：US20200027705A1

公开(公告)日：2020-01-23

申请号：US16268790

申请日：2019-02-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kwang-Nam KIM ,  Sung-Yeon KIM ,  Hyung-Jun KIM ,  Jong-Woo SUN ,  Sang-Rok OH ,  Jung-Pyo HONG

IPC: H01J37/32 ,  H01L21/683

Abstract: A substrate support apparatus includes a substrate stage to support a substrate, and a ground ring assembly along a circumference of the substrate stage, the ground ring assembly including a ground ring body, the ground ring body having a plurality of recesses along a circumferential portion thereof, and a plurality of ground blocks movable to be received into respective recesses of the plurality of recesses, the plurality of ground blocks including a conductive material to be electrically grounded.