公开(公告)号：US10134713B2

公开(公告)日：2018-11-20

申请号：US15815042

申请日：2017-11-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kwang-seok Kim ,  Sun-won Kang ,  Il-joon Kim

IPC: H01L25/065 ,  H01L23/64 ,  H01L23/498 ,  H01L23/00

Abstract: A semiconductor package includes a printed circuit board, a resistor circuit, and first and second semiconductor chips. First and second pads are on a first surface of the printed circuit board, and external connection terminal is on a second surface of the printed circuit board. The resistor circuit has a first connection terminal connected to the first pad and a second connection terminal connected to the second pad. The first semiconductor chip is connected to the first pad and the second semiconductor chip is stacked on the first semiconductor chip and connected to the second pad. The printed circuit board includes a signal transfer line connecting a branch in the printed circuit board to the external connection terminal. A first transfer line connects the branch to the first pad. A second transfer line connects the branch to the second pad.