公开(公告)号：US20130249744A1

公开(公告)日：2013-09-26

申请号：US13768499

申请日：2013-02-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Soo-Young JANG ,  Dong-Hwan KIM ,  Austin KIM ,  Se-Ho KIM ,  Kong-Min SA ,  Jae-Ho LEE ,  Byung-Chan JANG ,  In-Jin HWANG

IPC: H01Q21/30

CPC classification number: H01Q21/30 ,  H01Q1/243 ,  H01Q9/42

Abstract: A built-in antenna device for an electronic device for communication used in a multi-band is provided. The built-in antenna device includes a PCB, a first antenna radiator disposed on the PCB, and a second antenna radiator which has the same power feeding point as the first antenna radiator and is disposed at a housing of the electronic device, wherein the first antenna radiator and the second antenna radiator are configured to operate at different frequency bands.

Abstract translation: 提供了一种用于在多频带中使用的用于通信的电子设备的内置天线装置。 内置天线装置包括PCB，布置在PCB上的第一天线辐射器以及具有与第一天线辐射体相同的供电点并设置在电子设备的壳体上的第二天线辐射器，其中第一 天线辐射器和第二天线辐射器被配置为在不同的频带工作。