公开(公告)号：US20200020641A1

公开(公告)日：2020-01-16

申请号：US16280186

申请日：2019-02-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： YEONG-KWON KO ,  JUN-YEONG HEO ,  UN-BYOUNG KANG ,  JA-YEON LEE

IPC: H01L23/544 ,  H01L21/78 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065 ,  H01L25/18

Abstract: A semiconductor package includes a package substrate, a first semiconductor device on an upper surface of the package substrate, a second semiconductor device on an upper surface of the first semiconductor device, a first connection bump attached to a lower surface of the package substrate, a second connection bump interposed between and electrically connected to the package substrate and the first semiconductor device, and a third connection bump interposed between and electrically connected to the first semiconductor device and the second semiconductor device. The first semiconductor device has an edge and a step at the edge.