公开(公告)号：US20170278895A1

公开(公告)日：2017-09-28

申请号：US15387751

申请日：2016-12-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SONG-YI KIM ,  JAE-KYU LEE ,  DAE-HWAN KANG ,  GWAN-HYEOB KOH

IPC: H01L27/24 ,  H01L45/00

CPC classification number: H01L27/2481 ,  H01L27/2427 ,  H01L45/06 ,  H01L45/1233 ,  H01L45/1246 ,  H01L45/1253 ,  H01L45/144 ,  H01L45/1675

Abstract: A plurality of first conductive patterns is disposed on a substrate. Each of the plurality of first conductive patterns extends in a first direction. A first selection pattern is disposed on each of the plurality of first conductive patterns. A first barrier portion surrounds the first selection pattern. A first electrode and a first variable resistance pattern are disposed on the first selection pattern. A plurality of second conductive patterns is disposed on the first variable resistance pattern. Each of the plurality of second conductive patterns extends in a second direction crossing the first direction,