公开(公告)号：US20250167147A1

公开(公告)日：2025-05-22

申请号：US18747852

申请日：2024-06-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： JAESIC LEE

IPC: H01L23/00 ,  H01L23/48 ,  H01L23/522 ,  H01L25/10 ,  H10B80/00

Abstract: A semiconductor package according to an embodiment includes a first semiconductor die including a back side bonding structure; and a second semiconductor die including a front side bonding structure bonded to the back side bonding structure, wherein the back side bonding structure includes a first dielectric layer; and first bonding pads passing through the first dielectric layer, the front side bonding structure includes a second dielectric layer bonded to the first dielectric layer; and second bonding pads with each second bonding pad bonded to a respective first bonding pad and passing through the second dielectric layer, and the first dielectric layer includes oblique edge portions around the first bonding pads at the surface facing the second dielectric layer.

公开(公告)号：US20250046757A1

公开(公告)日：2025-02-06

申请号：US18589650

申请日：2024-02-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： HYUNSOO CHUNG ,  KWANG-SOO KIM ,  JAESIC LEE

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/373 ,  H01L23/48 ,  H10B80/00

Abstract: Disclosed are semiconductor packages and their fabrication methods. The semiconductor package comprises a base die that includes first dummy pads on an edge at a top surface of the base die; a plurality of memory dies on the base die; a plurality of conductive posts spaced apart from the memory dies and on the edge of the base die; a mold layer that covers the base die, the memory dies, and the conductive posts; and a heat spreader that includes second dummy pads on an edge at a bottom surface of the heat spreader and third dummy pads on a central portion of the bottom surface of the heat spreader, wherein the heat spreader is disposed on the memory dies and the mold layer. The first dummy pads are correspondingly connected to the second dummy pads through the conductive posts and the second dummy pads are in contact with the conductive posts.