公开(公告)号：US20250016988A1

公开(公告)日：2025-01-09

申请号：US18424577

申请日：2024-01-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： DONG-SIK PARK ,  JAE WON NA ,  JIHEE JUN

IPC: H10B12/00

Abstract: A semiconductor device includes a substrate including cell array and peripheral regions, a bit line positioned in the cell array region and extending in a first direction, a shielding line extending in the first direction from the cell array region to the peripheral region and positioned adjacent to the bit line in a second direction crossing the first direction, a shielding contact line positioned in the peripheral region, extending in the second direction, and connected to the shielding line, a channel pattern positioned on the bit line and extending in a direction vertical from the bit line, a word line extending in the second direction and positioned on the channel pattern, a gate insulation pattern positioned between the channel pattern and the word line, an insulation pattern positioned on the word line, a landing pad connected to the channel pattern, and a data storage pattern connected to the landing pad.