公开(公告)号：US20200075453A1

公开(公告)日：2020-03-05

申请号：US16534057

申请日：2019-08-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SUIN KIM ,  JIYONG KIM ,  SUNG-KI LEE

IPC: H01L23/367 ,  H01L23/02 ,  G11C5/04 ,  H05K5/02

Abstract: A semiconductor device includes a first case part, a second case part coupled to the first case part to provide a case, a semiconductor module disposed within the case closer to the second case part than to the first case part, and a plate interposed between the first case part and the semiconductor module. The plate is a thermal conductor, i.e., is of material having thermal conductivity, to transfer heat generated by the semiconductor module to the case where the heat can dissipate to the outside of the semiconductor device.

公开(公告)号：US20240015901A1

公开(公告)日：2024-01-11

申请号：US18121925

申请日：2023-03-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： JIYONG KIM

IPC: H05K5/00

CPC classification number: H05K5/006

Abstract: A solid state drive (SSD) device according to an exemplary embodiment includes: a board including on which a plurality of non-volatile memory (NVM) chips, a controller chip, and a buffer memory chip are mounted; a first cover covering a first surface of the board and including a fastening portion having a coupling-hole and recessed toward the board; a second cover covering a second surface of the board and coupled to the first cover; a fastening member having one end portion passing through the coupling-hole to fasten the first cover and the second cover to each other; and a cap inserted into the fastening portion to block exposure of the fastening member and irreversibly coupled to the fastening portion.

公开(公告)号：US20210287959A1

公开(公告)日：2021-09-16

申请号：US17332574

申请日：2021-05-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： SUIN KIM ,  JIYONG KIM ,  SUNG-KI LEE

IPC: H01L23/367 ,  H05K5/02 ,  G11C5/04 ,  H01L23/02

Abstract: A semiconductor device includes a first case part, a second case part coupled to the first case part to provide a case, a semiconductor module disposed within the case closer to the second case part than to the first case part, and a plate interposed between the first case part and the semiconductor module. The plate is a thermal conductor, i.e., is of material having thermal conductivity, to transfer heat generated by the semiconductor module to the case where the heat can dissipate to the outside of the semiconductor device.