公开(公告)号：US20180061041A1

公开(公告)日：2018-03-01

申请号：US15466951

申请日：2017-03-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Tae Heung AHN ,  Soo Ryonng Kim ,  Tae Joong kim ,  Jun Bum Park ,  Byeong Hwan Jeon ,  Jae Chol Joo

IPC: G06T7/00 ,  H04N5/225 ,  G01B11/27 ,  G01N21/95

CPC classification number: G06T7/0004 ,  G01B11/272 ,  G01N21/9501 ,  G06T2207/30148 ,  H04N5/2256 ,  H04N5/2257

Abstract: A wafer inspection apparatus includes a linear stage configured to support a chuck on which a wafer is disposed and to move the chuck along a guide rail, wherein the guide rail extends in a first direction, an image sensor module overlapping the linear stage, and a rotary stage supported by the linear stage. The rotary stage is configured to rotate the chuck in a state where a center of the wafer is aligned with the image sensor module. The image sensor module includes a light source directing light onto the wafer, and an image sensor extending in a second direction crossing the first direction.

公开(公告)号：US10733719B2

公开(公告)日：2020-08-04

申请号：US15466951

申请日：2017-03-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Tae Heung Ahn ,  Soo Ryonng Kim ,  Tae Joong Kim ,  Jun Bum Park ,  Byeong Hwan Jeon ,  Jae Chol Joo

IPC: H04N5/225 ,  G06T7/00 ,  G01B11/27 ,  G01N21/95

Abstract: A wafer inspection apparatus includes a linear stage configured to support a chuck on which a wafer is disposed and to move the chuck along a guide rail, wherein the guide rail extends in a first direction, an image sensor module overlapping the linear stage, and a rotary stage supported by the linear stage. The rotary stage is configured to rotate the chuck in a state where a center of the wafer is aligned with the image sensor module. The image sensor module includes a light source directing light onto the wafer, and an image sensor extending in a second direction crossing the first direction.