公开(公告)号：US11317540B2

公开(公告)日：2022-04-26

申请号：US16985290

申请日：2020-08-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungchul Hur ,  Jaehong Park ,  Bumjun Kim ,  Yusuf Cinar ,  Hanhong Lee ,  Youngseok Hong ,  Doil Kong ,  Jaeheon Ma

IPC: H05K7/20 ,  H05K1/02 ,  G11B33/14

Abstract: A solid state drive (SSD) apparatus includes a case including an air tunnel disposed between an inner plate and an upper wall and an accommodation space between the inner plate and a lower wall. The air tunnel extends in a first direction, and both end parts of the air tunnel are exposed to the outside. A substrate is disposed in the accommodation space. At least one semiconductor chip is disposed on the substrate.

公开(公告)号：US11800686B2

公开(公告)日：2023-10-24

申请号：US17659766

申请日：2022-04-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungchul Hur ,  Jaehong Park ,  Bumjun Kim ,  Yusuf Cinar ,  Hanhong Lee ,  Youngseok Hong ,  Doil Kong ,  Jaeheon Ma

IPC: H05K7/20 ,  G11B33/14 ,  H05K1/02

CPC classification number: H05K7/20436 ,  G11B33/1426 ,  H05K1/0201 ,  H05K1/0203 ,  H05K7/20163 ,  G11B33/142

Abstract: A solid state drive (SSD) apparatus includes a case including an air tunnel disposed between an inner plate and an upper wall and an accommodation space between the inner plate and a lower wall. The air tunnel extends in a first direction, and both end parts of the air tunnel are exposed to the outside. A substrate is disposed in the accommodation space. At least one semiconductor chip is disposed on the substrate.