公开(公告)号：US20240022655A1

公开(公告)日：2024-01-18

申请号：US18204695

申请日：2023-06-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungduck PARK ,  Kwondeuk Yoon ,  Kitae Park ,  Yunho Son ,  Jaehoon Yoon ,  Cheolwoong Yoon ,  Youngsoo Kim ,  Kidoc Son ,  Hyunsuk Choi ,  Yongduk Kwon ,  Jongbo Kim

IPC: H04M1/02

CPC classification number: H04M1/026

Abstract: An electronic device includes: a side bezel structure including a first body surrounding an inner space of the device, and a second body extending from the first body into the inner space and including a through hole; a plate including a support portion within the inner space; a protrusion portion extending from the support portion into the through hole, the protrusion portion being coupling to the second body and corresponding to the through hole; and a conductive adhesive member coupling the through hole and the protrusion portion, which is disposed between the through hole and the protrusion portion. An area of the protrusion portion contacting one surface of the second body toward the support portion is narrower than an area of the protrusion portion contacting another surface of the second body.