公开(公告)号：US20250054735A1

公开(公告)日：2025-02-13

申请号：US18595009

申请日：2024-03-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wookhyeon Kwon ,  Minnhoo Choi ,  Songyun Kang ,  Yongwoo Kim ,  Jaehyun Kim ,  Hansol Kim ,  Chulwoo Park ,  Jaehyun Soh ,  Dongkyu Shin ,  Deukho Lee ,  Hoontaek Lee ,  Junghyun Cho ,  Yangyeon Chu ,  Kaan Uzun

IPC: H01J37/32

Abstract: A system is described for protecting the edge region of a substrate during a plasma process. The system includes an outer ring with a plurality of outer uneven portions and an inner ring also with a plurality of inner uneven portions. The outer ring covers the edge region of the substrate. The inner ring may rotate around the center point of the outer ring. When the inner ring is rotated, each of the inner uneven portions and each the outer uneven portions may slide by each other to overlap and to form openings. Changes of the opening ratios in the gaps (or the overlap ratios of the inner and outer uneven portions) may change a thickness of a plasma sheath. Thus, the plasma sheath in an edge region of the substrate may be readily controlled.