公开(公告)号：US20200152427A1

公开(公告)日：2020-05-14

申请号：US16407508

申请日：2019-05-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eun-Woo Lee ,  Kyo-Hyeok Kim ,  Hyo-Sung Kim ,  Jong-Woo Sun ,  Seung-Bo Shim ,  Kyung-Hoon Lee ,  Jae-Hyun Lee ,  Ji-Soo Im ,  Min-Young Hur

IPC: H01J37/32 ,  H01J37/21

Abstract: A plasma processing apparatus includes a substrate chuck having a first surface for supporting a substrate, a second surface opposite to the first surface, and a sidewall, a focus ring for surrounding a perimeter of the substrate, and an edge block for supporting the focus ring. The edge block includes a side electrode on the sidewall of the substrate chuck and a bottom electrode on the second surface of the substrate chuck.

公开(公告)号：US11521836B2

公开(公告)日：2022-12-06

申请号：US16407508

申请日：2019-05-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eun-Woo Lee ,  Kyo-Hyeok Kim ,  Hyo-Sung Kim ,  Jong-Woo Sun ,  Seung-Bo Shim ,  Kyung-Hoon Lee ,  Jae-Hyun Lee ,  Ji-Soo Im ,  Min-Young Hur

IPC: H01J37/32 ,  H01J37/21

Abstract: A plasma processing apparatus includes a substrate chuck having a first surface for supporting a substrate, a second surface opposite to the first surface, and a sidewall, a focus ring for surrounding a perimeter of the substrate, and an edge block for supporting the focus ring. The edge block includes a side electrode on the sidewall of the substrate chuck and a bottom electrode on the second surface of the substrate chuck.