公开(公告)号：US20200211973A1

公开(公告)日：2020-07-02

申请号：US16814528

申请日：2020-03-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae-Min JUNG ,  JiAh MIN

IPC: H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/367 ,  H01L23/552 ,  H01L23/00

Abstract: A film package includes a film substrate, a first semiconductor chip on a first surface of the film substrate, a second semiconductor chip on the first surface of the film substrate, and a first conductive film on the first surface of the film substrate. The first conductive film covers the first semiconductor chip and the second semiconductor chip and includes a slit(s) or a notch(es). The slit(s) or notch(es) is/are disposed in a bridge region between the first semiconductor chip and the second semiconductor chip, in a plan view of the package.