公开(公告)号：US20230385185A1

公开(公告)日：2023-11-30

申请号：US18198577

申请日：2023-05-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jicheon Kim ,  Jinwoo Park ,  Yeonho Jeong ,  Seonil Brian Choi

IPC: G06F11/36

CPC classification number: G06F11/3684 ,  G06F11/3692

Abstract: A method of simulating an integrated circuit includes providing at least one test case to a simulation tool, obtaining at least one first simulation result and at least one first simulation log from the simulation tool, classifying, with a first machine learning model, the at least one test case into one fail class of a plurality of fail classes, generating at least one renewed test case by applying, with a controller, a solution to the at least one test case, and providing the at least one renewed test case to the simulation tool.