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公开(公告)号:US20220157831A1
公开(公告)日:2022-05-19
申请号:US17378317
申请日:2021-07-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Seokcheon BAEK , Younghwan SON , Miram KWON , Junyong PARK , Jiho LEE
IPC: H01L27/1157 , H01L27/11519 , H01L27/11524 , H01L27/11526 , H01L27/11556 , H01L27/11582 , H01L27/11573 , H01L27/11565
Abstract: Provided is a three-dimensional semiconductor memory device including a first substrate that includes a cell array region and a connection region; first and second electrode layers that are sequentially stacked and spaced apart from each other on the first substrate, and an end portion of the first electrode layer and an end portion of the second electrode layer are offset from each other on the connection region; a first cell contact penetrating the second electrode layer and the first electrode layer such as to be connected to the second electrode layer on the connection region; and a first contact dielectric pattern between the first cell contact and the first electrode layer. The first cell contact includes columnar part that vertically extends from a top surface of the first substrate, and a connection part that laterally protrudes from the columnar part and contacts the second electrode layer.
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公开(公告)号:US20230136399A1
公开(公告)日:2023-05-04
申请号:US17978534
申请日:2022-11-01
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yeongjun KIM , Jiho LEE , Myoungsung SIM , Hunki LEE , Minwoo YOO
Abstract: An electronic device is provided. The electronic device includes a sound module, a support member including an accommodation space to accommodate the sound module, a display module disposed above the support member, and a duct structure to deliver sound generated in the sound module to the outside, the duct structure including an inlet space formed to be at least partially surrounded by the support member and positioned between the sound module and the display module, a first conduit branched from the inlet space in a first direction and formed to extend through at least a part of the support member, a second conduit disposed side by side with the first conduit, branched from the inlet space in a second direction, and formed along between the display module and the support member, and an output space connected to the first conduit and the second conduit and disposed adjacent to an outlet of the sound.
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