公开(公告)号：US11444070B2

公开(公告)日：2022-09-13

申请号：US17200984

申请日：2021-03-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yongjin Park ,  Jiin Yu ,  Jin-San Jung

IPC: H01L25/18 ,  H01L23/00 ,  H01L23/48

Abstract: A semiconductor package may include a first semiconductor chip, a second semiconductor chip on the first semiconductor chip, and an adhesive layer between the first semiconductor chip and the second semiconductor chip. The first semiconductor chip may include a semiconductor substrate and a plurality of protection layers on the semiconductor substrate. The topmost layer of the protection layers may have a top surface with convex portions and concave portions, and the convex portions and the concave portions may be in contact with the adhesive layer.