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1.发明授权公开(公告)号：US10908505B2
公开(公告)日：2021-02-02
申请号：US16101883
申请日：2018-08-13
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sang Hyun Kwon , Jin Hee Hwang , Seong Chan Park , Young Ju Lee
IPC: G03F7/32
Abstract: A photoresist developer composition contains: a quaternary alkyl ammonium compound; and a corrosion inhibitor. The corrosion inhibitor contains a silane-based compound and an azole-based compound A manufacturing method of a semiconductor package includes using the photoresist developer composition.
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