Electronic apparatus having package base substrate

    公开(公告)号:US11064603B2

    公开(公告)日:2021-07-13

    申请号:US16270874

    申请日:2019-02-08

    Abstract: Provided is an electronic apparatus capable of improving time margin. The electronic apparatus includes: a base substrate including a substrate base including a plurality of layers and a plurality of wiring layers between the layers; a controller chip and at least one memory semiconductor chip mounted on the base substrate; a signal line disposed in one of the wiring layers and connecting the controller chip to the at least one memory semiconductor chip; and a pair of open stubs disposed in another wiring layer, connected to both ends of the signal line, and extending to face each other with a gap.

    ELECTRONIC APPARATUS HAVING PACKAGE BASE SUBSTRATE

    公开(公告)号:US20190357351A1

    公开(公告)日:2019-11-21

    申请号:US16270874

    申请日:2019-02-08

    Abstract: Provided is an electronic apparatus capable of improving time margin. The electronic apparatus includes: a base substrate including a substrate base including a plurality of layers and a plurality of wiring layers between the layers; a controller chip and at least one memory semiconductor chip mounted on the base substrate; a signal line disposed in one of the wiring layers and connecting the controller chip to the at least one memory semiconductor chip; and a pair of open stubs disposed in another wiring layer, connected to both ends of the signal line, and extending to face each other with a gap.

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