公开(公告)号：US20250015063A1

公开(公告)日：2025-01-09

申请号：US18655903

申请日：2024-05-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jing Cheng Lin ,  Youngkun Jee

IPC: H01L25/10 ,  H01L23/00 ,  H01L23/31 ,  H01L23/367 ,  H01L23/48 ,  H01L23/538 ,  H01L25/065 ,  H10B80/00

Abstract: Provided is a semiconductor package including a redistribution substrate, a first semiconductor chip on the redistribution substrate, a second semiconductor chip on the redistribution substrate and spaced apart from the first semiconductor chip in a horizontal direction, a third semiconductor chip on the second semiconductor chip, and a heat dissipation chip on the first semiconductor chip and spaced apart from the third semiconductor chip in the horizontal direction, wherein the second semiconductor chip includes a plurality of through vias passing through at least a portion of the second semiconductor chip in a vertical direction, and wherein a metal pad and an adhesive layer are between the first semiconductor chip and the heat dissipation chip.