公开(公告)号：US20210257294A1

公开(公告)日：2021-08-19

申请号：US17307212

申请日：2021-05-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinkuk BAE ,  Hyunsoo CHUNG ,  Inyoung LEE ,  Donghyeon JANG

IPC: H01L23/522 ,  H01L23/31 ,  H01L23/00 ,  H01L21/768

Abstract: A semiconductor device includes a semiconductor substrate, a conductive pad disposed on the semiconductor substrate, and a pillar pattern disposed on the conductive pad. The semiconductor device further includes a solder seed pattern disposed on the pillar pattern, and a solder portion disposed on the pillar pattern and the solder seed pattern. A first width of the solder seed pattern is less than a second width of a top surface of the pillar pattern.