公开(公告)号：US20240395501A1

公开(公告)日：2024-11-28

申请号：US18642124

申请日：2024-04-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyojin PARK ,  Songyun KANG ,  Jiyun JU

IPC: H01J37/32

Abstract: An inductively coupled plasma processing apparatus includes a main body having an internal space; a chamber in the internal space of the main body and having an open upper side and an open lower side; a window unit coupled to an upper portion of the chamber to form a processing space; and a coil in an upper portion of the window unit, wherein the coil is configured to form an electromagnetic field. The main body includes a substrate installation portion configured to receive a substrate so that the substrate is below the chamber. The window unit includes a plurality of windows, and each of the plurality of windows has a respective different thickness and/or a respective different material.