公开(公告)号：US12089384B2

公开(公告)日：2024-09-10

申请号：US17436357

申请日：2021-08-10

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Hojong Kim ,  Changhwan Jin ,  Jonghun Choi ,  Byungchul Lee ,  Jaeyoung Huh ,  Hyunchul Hong ,  Jaeuk Ryu

IPC分类号： G01R15/04 ,  G01R19/10 ,  H05K1/02 ,  H05K9/00

CPC分类号： H05K9/0028 ,  G01R15/04 ,  G01R19/10 ,  H05K1/0216

摘要： An electronic device including a substrate on which an electronic component is mounted according to various embodiments may include: a first electromagnetic interference (EMI) shield configured to shield the electronic component included in a first region of the substrate; and a second EMI shield supported by at least a part of the first EMI shield and configured to shield the electronic component included in a second region of the substrate.