公开(公告)号：US20140014682A1

公开(公告)日：2014-01-16

申请号：US14029350

申请日：2013-09-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joo Yong KIM ,  Seung Ki CHOI ,  Jee Hun HONG

IPC: B65B3/04

CPC classification number: B65B3/04 ,  B29C31/042 ,  B29C39/10 ,  B29C39/24 ,  B29C39/44 ,  B29L2011/00 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: There is provided a resin dispensing apparatus for a light emitting device package and a method of manufacturing a light emitting device package using the same. The resin dispensing apparatus includes a resin dispensing part including a resin storage portion filled with a resin therein and a resin discharge portion combined with the resin storage portion and discharging the resin therefrom; a supporting part having a light emitting device package disposed on an upper surface thereof and electrically connected to the light emitting device package; a voltage applying part having both terminals respectively connected to the resin dispensing part and the supporting part to apply a voltage thereto; and a sensing part electrically connected to the resin dispensing part and the supporting part individually and sensing a contact between the resin dispensing part and the light emitting device package with an electrical signal.

Abstract translation: 提供了一种用于发光器件封装的树脂分配装置和使用其的发光器件封装的制造方法。 树脂分配装置包括树脂分配部，树脂分配部分包括填充有树脂的树脂存储部分和与树脂存储部分结合并从其中排出树脂的树脂排出部分; 支撑部件，其具有设置在其上表面上并电连接到发光器件封装的发光器件封装; 电压施加部分，其两端分别连接到树脂分配部分和支撑部分以向其施加电压; 以及感测部分分别电连接到树脂分配部分和支撑部分，并用电信号感测树脂分配部分和发光器件封装之间的接触。