公开(公告)号：US10896881B2

公开(公告)日：2021-01-19

申请号：US16819413

申请日：2020-03-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Suk Ho Lee ,  Dong Joon Oh ,  Ju Suk Kang

IPC: H01L23/552 ,  H01L23/00 ,  H01L21/56 ,  H01L23/498

Abstract: A semiconductor package includes a frame having a first through-hole, a semiconductor chip disposed on the first through-hole an having an active surface on which a connection pad is disposed and an inactive surface, a first encapsulant covering at least a portion of the inactive surface and a side surface of the semiconductor chip, a connection structure disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad of the semiconductor chip and a ground pattern layer, a side surface cover layer covering at least an outer side surface of the frame, and a metal layer disposed on the upper surface of the first encapsulant and extending downwardly along the side surface cover layer to cover the side surface cover layer and a portion of the side surface of the connection structure.

公开(公告)号：US10607945B1

公开(公告)日：2020-03-31

申请号：US16542470

申请日：2019-08-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Suk Ho Lee ,  Dong Joon Oh ,  Ju Suk Kang

IPC: H01L23/552 ,  H01L23/00 ,  H01L23/498 ,  H01L21/56

Abstract: A semiconductor package includes a frame having a first through-hole, a semiconductor chip disposed on the first through-hole an having an active surface on which a connection pad is disposed and an inactive surface, a first encapsulant covering at least a portion of the inactive surface and a side surface of the semiconductor chip, a connection structure disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pad of the semiconductor chip and a ground pattern layer, a side surface cover layer covering at least an outer side surface of the frame, and a metal layer disposed on the upper surface of the first encapsulant and extending downwardly along the side surface cover layer to cover the side surface cover layer and a portion of the side surface of the connection structure.