公开(公告)号：US20200013042A1

公开(公告)日：2020-01-09

申请号：US16482411

申请日：2018-03-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ji Hye LEE ,  Ho Seock CHOI ,  Jun Ho HWANG ,  Bo Ram KIM ,  Sang Eun SHIN ,  Sung Jun LIM ,  Se Jun HAN

IPC: G06Q20/32 ,  G06Q20/34

Abstract: According to various embodiments of the disclosure, a first payment server may include a communication module, and a processor to receive a card registration request including account information from a first electronic device, to request a second payment server to provide card information on a card, which is registered by a second electronic device, in association with the account information, to receive the card information from the second payment server, and to transmit, to a financial company server, the card registration request of the first electronic device based on the received card information.