公开(公告)号：US20230260891A1

公开(公告)日：2023-08-17

申请号：US18308433

申请日：2023-04-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JI HWANG KIM ,  HYUNKYU KIM ,  JONGBO SHIM ,  EUNHEE JUNG ,  KYOUNGSEL CHOI

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/49838 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/45 ,  H01L25/0657

Abstract: A semiconductor package includes a lower package, an interposer on the lower package, and an under-fill layer between the interposer and the lower package. The interposer includes a through hole that vertically penetrates the interposer. The under-fill layer includes an extension that fills at least a portion of the through hole.